Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics

Conference object English OPEN
Muraoka , Yoshio; Seki , Kenichi; Nishimura , Hidekazu;
(2014)
  • Publisher: Springer
  • Related identifiers: doi: 10.1007/978-3-662-45937-9_24
  • Subject: Product lifecycle management | SysML | System level | [ INFO ] Computer Science [cs] | Simulation | Low-temperature burn injury | Embedded system | Software change | Collab- orative design | Electronic products | Thermal design

Part 6: Industry and Consumer Products; International audience; Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software update... View more
  • References (16)
    16 references, page 1 of 2

    Balmelli L (2007) An Overview of the Systems Modeling Language for Products and Systems Development. J Object Technology 6(6):149-177

    Chandrakasan A, Sheng A, Brodersen W (1992) Low-power CMOS digital design. IEEE J Solid-State Circuits 27(4):473-484

    Consumer Reports (2012) Our test finds new iPad hits 116 degrees while running games. http://news.consumerreports.org/electronics/2012/03/our-test-finds-new-ipad-hits-116- degrees-while-running-games.html. Accessed 17 Feb 2014

    Qualcomm (2012) Snapdragon S4 Thermal Comparison and Butter Benchmark. http://www.qualcomm.com/media/videos/snapdragon-s4-thermal-comparison-andbutter-benchmark. Accessed 17 Feb 2014

    Siemens (2012) Role of PLM in the Software Lifecycle. White Paper. http://m.plm.automation.siemens.com/en_us/Images/15825_tcm1224-75783.pdf. Accessed 17 Feb 2014

    Kuusela J (2012) How variation changes when an embedded product ceases to be embedded?. In: WICSA/ECSA 2012, Companion Volume, P 147

    Google (2013) In: Google Press Event, San Francisco, 24 July 2013

    Hatakeyama T, Ishizuka M, Nakagawa S (2010) Estimation of maximum temperature in 3D-integrated package by thermal network method. In: Electronics Packaging Technology Conference (EPTC), p68

    Hao S, Ding L, Halfond WGJ, Govindan R (2012) Estimating android applications' CPU energy usage via bytecode profiling. In: Green and Sustainable Software (GREENS), doi: 10.1109/GREENS.2012.6224263

    Moritz A, Henriques F (1947) Studies of Thermal Injury: II. The Relative Importance of Time and Surface Temperature in the Causation of Cutaneous Burns. Am J Pathology 23: 695-720

  • Metrics
Share - Bookmark