Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics

Conference object English OPEN
Muraoka , Yoshio; Seki , Kenichi; Nishimura , Hidekazu;
  • Publisher: Springer
  • Related identifiers: doi: 10.1007/978-3-662-45937-9_24
  • Subject: Product lifecycle management | SysML | System level | [ INFO ] Computer Science [cs] | Simulation | Low-temperature burn injury | Embedded system | Software change | Collab- orative design | Electronic products | Thermal design

Part 6: Industry and Consumer Products; International audience; Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software update... View more
  • References (16)
    16 references, page 1 of 2

    Balmelli L (2007) An Overview of the Systems Modeling Language for Products and Systems Development. J Object Technology 6(6):149-177

    Chandrakasan A, Sheng A, Brodersen W (1992) Low-power CMOS digital design. IEEE J Solid-State Circuits 27(4):473-484

    Consumer Reports (2012) Our test finds new iPad hits 116 degrees while running games. degrees-while-running-games.html. Accessed 17 Feb 2014

    Qualcomm (2012) Snapdragon S4 Thermal Comparison and Butter Benchmark. Accessed 17 Feb 2014

    Siemens (2012) Role of PLM in the Software Lifecycle. White Paper. Accessed 17 Feb 2014

    Kuusela J (2012) How variation changes when an embedded product ceases to be embedded?. In: WICSA/ECSA 2012, Companion Volume, P 147

    Google (2013) In: Google Press Event, San Francisco, 24 July 2013

    Hatakeyama T, Ishizuka M, Nakagawa S (2010) Estimation of maximum temperature in 3D-integrated package by thermal network method. In: Electronics Packaging Technology Conference (EPTC), p68

    Hao S, Ding L, Halfond WGJ, Govindan R (2012) Estimating android applications' CPU energy usage via bytecode profiling. In: Green and Sustainable Software (GREENS), doi: 10.1109/GREENS.2012.6224263

    Moritz A, Henriques F (1947) Studies of Thermal Injury: II. The Relative Importance of Time and Surface Temperature in the Causation of Cutaneous Burns. Am J Pathology 23: 695-720

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