On Packaging of MEMS. Simulation of Transfer Moulding and Packaging Stress and their Effect on a Family of piezo-resistive Pressure Sensors

Doctoral thesis English OPEN
Krondorfer, Rudolf H.;
  • Publisher: Fakultet for ingeniørvitenskap og teknologi

Micro Electro Mechanical Systems (MEMS) produced to date include IR detectors, accelerometers, pressure sensors, micro lenses, actuators, chemical sensors, gear drives, RF devices, optical processor chips, micro robots and devices for biomedical analysis. The track for ... View more
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