Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Article, Review English OPEN
Lei Sun; Liang Zhang;
(2015)

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettabil... View more
  • References (101)
    101 references, page 1 of 11

    Xu, S., Habib, A. H., Pickel, A. D., McHenry, M. E.. Magnetic nanoparticle-based solder composites for electronic packaging applications. Progress in Materials Science. 2015; 67: 95-160

    Keller, J., Baither, D., Wilke, U., Schmitz, G.. Mechanical properties of Pb-free SnAg solder joints. Acta Materialia. 2011; 59 (7): 2731-2741

    El-Daly, A. A., El-Taher, A. M.. Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders. Materials & Design. 2013; 51: 789-796

    El-Daly, A. A., Hammad, A. E.. Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions. Materials and Design. 2012; 40: 292-298

    Shalaby, M. R.. Effect of silicon addition on mechanical and electrical properties of Sn-Zn based alloys rapidly quenched from melt. Materials Science and Engineering: A. 2012; 550: 112-117

    Kanlayasiri, K., Mongkolwongrojn, M., Ariga, T.. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy. Journal of Alloys and Compounds. 2009; 485 (1-2): 225-230

    Chuang, C. L., Tsao, L. C., Lin, H. K., Feng, L. P.. Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder. Materials Science and Engineering A. 2012; 558: 478-484

    Lin, L. W., Song, J. M., Lai, Y. S., Chiu, Y. T., Lee, N. C., Uan, J. Y.. Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectronics Reliability. 2009; 49 (3): 235-241

    Fallahi, H., Nurulakmal, M. S., Arezodar, A. F., Abdullah, J.. Effect of iron and indium on IMC formation and mechanical properties of lead-free solder. Materials Science and Engineering A. 2012; 553: 22-31

    El-Daly, A. A., Hammad, A. E., Al-Ganainy, G. S., Ragab, M.. Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders. Materials Science and Engineering A. 2014; 608: 130-138

  • Metrics
Share - Bookmark