Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging
- Publisher: Hindawi Limited
Advances in Materials Science and Engineering
(issn: 1687-8434, eissn: 1687-8442)
TA401-492 | Materials of engineering and construction. Mechanics of materials | Article Subject
SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettabil...