Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Article, Review English OPEN
Lei Sun ; Liang Zhang (2015)
  • Publisher: Hindawi Limited
  • Journal: Advances in Materials Science and Engineering (issn: 1687-8434, eissn: 1687-8442)
  • Related identifiers: doi: 10.1155/2015/639028
  • Subject: TA401-492 | Materials of engineering and construction. Mechanics of materials | Article Subject

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettabil... View more
Share - Bookmark