Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures

Article, Conference object English OPEN
Fischer A.C.; Lapisa M.; Roxhed N.; Stemme G.; Niklaus F.;
(2010)
  • Publisher: IEEE
  • Related identifiers: doi: 10.1109/MEMSYS.2010.5442462
  • Subject: nickel | micromechanical devices | contact resistance | plasma deposited coatings | Övrig elektroteknik, elektronik och fotonik | electroless deposition | Other electrical engineering, electronics and photonics

This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre- treatments or metal oxide etches are required. This enables the manufacturing of low-resistan... View more
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