publication . Article . 2014

Status and perspectives of pixel sensors based on 3D vertical integration

Name: Status and perspectives of pixel sensors based on 3D vertical integration
Creator: Valerio Re
Keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Nuclear and High Energy Physics, Instrumentation

Valerio Re;

Open Access English

Published: 01 Jan 2014

Publisher: Nucl. Instrum. Methods Phys. Res., A

Summary

Abstract

This paper reviews the most recent developments of 3D integration in the field of silicon pixel sensors and readout integrated circuits. This technology may address the needs of future high energy physics and photon science experiments by increasing the electronic functional density in small pixel readout cells and by stacking various device layers based on different technologies, each optimized for a different function. Current efforts are aimed at improving the performance of both hybrid pixel detectors and of CMOS sensors. The status of these activities is discussed here, taking into account experimental results on 3D devices developed in the frame of the 3D-...

doi: 10.1016/j.nima.2014.03.051

Subjects

arXiv: Physics::Instrumentation and Detectors

free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Nuclear and High Energy Physics, Instrumentation, Stacking, CMOS, Photon, Electronic engineering, Integrated circuit, law.invention, law, Nanotechnology, Silicon, chemistry.chemical_element, chemistry, Detector, Pixel, Physics, Vertical integration

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