publication . Article . 2014

Status and perspectives of pixel sensors based on 3D vertical integration

Valerio Re;
Open Access English
  • Published: 01 Jan 2014
  • Publisher: Nucl. Instrum. Methods Phys. Res., A
Abstract
This paper reviews the most recent developments of 3D integration in the field of silicon pixel sensors and readout integrated circuits. This technology may address the needs of future high energy physics and photon science experiments by increasing the electronic functional density in small pixel readout cells and by stacking various device layers based on different technologies, each optimized for a different function. Current efforts are aimed at improving the performance of both hybrid pixel detectors and of CMOS sensors. The status of these activities is discussed here, taking into account experimental results on 3D devices developed in the frame of the 3D-...
Subjects
arXiv: Physics::Instrumentation and Detectors
free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Nuclear and High Energy Physics, Instrumentation, Stacking, CMOS, Photon, Electronic engineering, Integrated circuit, law.invention, law, Nanotechnology, Silicon, chemistry.chemical_element, chemistry, Detector, Pixel, Physics, Vertical integration
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