P. Garrou, C. Bower, and P. Ramm (Eds.), Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, Weinheim: Wiley-VCH, 2008.
 M. Demarteau, Y. Arai, H.-G. Moser and V. Re, Developments of novel vertically integrated pixel sensors in the high energy physics community, Proc. 2009 IEEE International Conference on 3D System Integration (3D-IC), San Francisco, CA, September 28-30, 2009, pp. 1-7.
 A. Manazza, L. Gaioni, M. Manghisoni, L. Ratti, V. Re, G. Traversi and S. Zucca, Vertical integration approach to the readout of pixel detectors for vertexing applications, 2011 IEEE Nuclear Science Symposium Conference Record, Valencia (Spain), October 23 - 29, 2011, pp. 641- 647.
 E. Vilella, O. Alonso and A. Dieguez, 3D integration of Geiger-mode avalanche photodiodes aimed to very high fill-factor pixels for future linear colliders, NIM A, 731 (2013) 103.
 W. Dulinski, Short status of MAPS development at IPHC and plans for fine-pitch 3D integration of CMOS wafers, AIDA annual meeting 2013, Frascati, April 10-12, 2013. https://indico.cern.ch/contributionDisplay.py?contribId=208&confId=209429&sessionId=16
 D. Abbaneo and S. Marchioro, A hybrid module architecture for a prompt momentum discriminating tracker at HL-LHC, 2012 JINST 7 C09001.
 H. Graafsma, Towards edgeless detector tiles using 3D integration, 532.Heraeus-Seminar, Bad Honnef, Germany, May 23-25, 2013. http://indico.scc.kit.edu/indico/conferenceOtherViews.py?view=standard&confId=27