publication . Conference object . Article . 2014

The path towards the application of new microelectronic technologies in the AIDA community

Valerio Re;
Open Access
  • Published: 08 Jul 2014
  • Publisher: Sissa Medialab
  • Country: Italy
Abstract
The Workpackage 3 of the AIDA project has the goal of facilitating the access of the high energy physics community to the most advanced semiconductor technologies, from nanoscale CMOS to innovative interconnection processes. The AIDA network is studying 3D integration with the main goal of designing novel tracking and vertexing detector systems based on high-granularity pixel sensors, with aggressive and intelligent architectures for sensing, analogue and digital processing and storage, and data transmission. This talk reviews the ongoing efforts and discusses the challenges that are being tackled in this framework to qualify technologies and devices for actual ...
Subjects
free text keywords: ING-INF/01 - Elettronica, Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Electrical engineering, business.industry, business, Detector, Interconnection, Engineering, Pixel, Nanoscale cmos, Microelectronics, Data transmission
Related Organizations
Funded by
EC| AIDA
Project
AIDA
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA

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