Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector

Article, Preprint English OPEN
Poley, Luise ; Bloch, Ingo ; Edwards, Sam ; Friedrich, Conrad ; Gregor, Ingrid-Maria ; Jones, Tim ; Lacker, Heiko ; Pyatt, Simon ; Rehnisch, Laura ; Sperlich, Dennis ; Wilson, John (2015)
  • Publisher: Inst. of Physics
  • Journal: (issn: 1748-0221)
  • Related identifiers: doi: 10.1088/1748-0221/11/05/P05017
  • Subject: mechanical engineering | ATLAS | upgrade [tracking detector] | Physics - Instrumentation and Detectors | High Energy Physics - Experiment | microstrip [semiconductor detector] | pixel [semiconductor detector] | organic compounds | stability | readout [electronics]
    • ddc: ddc:610
    arxiv: Physics::Instrumentation and Detectors | Computer Science::Emerging Technologies | High Energy Physics::Experiment

The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive used initially between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). However, this glue has several disadvantages, which motivated the search for an alternative. This paper presents a study of six ultra-violet (UV) cure glues and a glue pad for possible use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, thermal conduction and shear strength. Samples were thermally cycled, radiation hardness and corrosion resistance were also determined. These investigations led to the exclusion of three UV cure glues as well as the glue pad. Three UV cure glues were found to be possible better alternatives than silver loaded glue. Results from electrical tests of first prototype modules constructed using these glues are presented.
  • References (19)
    19 references, page 1 of 2

    [1] L Musa and K Safarik. Letter of Intent for the Upgrade of the ALICE Experiment. Technical Report CERN-LHCC-2012-012. LHCC-I-022, CERN, Geneva, Aug 2012.

    [2] Collaboration ATLAS. Letter of Intent for the Phase-II Upgrade of the ATLAS Experiment. Technical Report CERN-LHCC-2012-022. LHCC-I023, CERN, Geneva, Dec 2012. Draft version for comments.

    [3] D Abbaneo. The CMS tracker for HL-LHC. pages 179-191. 13 p, 2013.

    [4] Letter of Intent for the LHCb Upgrade. Technical Report CERN-LHCC2011-001. LHCC-I-018, CERN, Geneva, Mar 2011.

    [5] Tra-Con. TRA-DUCT 2902 Technical Product Data Sheet, 2002.

    [6] Dymax Corporation. 3013 Product Data Sheet, 2014.

    [7] Dymax Corporation. 3025 Product Data Sheet, 2012.

    [8] Dymax Corporation. 6-621 Product Data Sheet, 2013.

    [9] Henkel. 3504 Technical Data Sheet, October 2014.

    [10] Henkel. 3525 Technical Data Sheet, February 2008.

  • Metrics
    No metrics available
Share - Bookmark