publication . Preprint . Article . Other literature type . 2014

Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges

R. Nisius; Ladislav Andricek; Stefano Terzo; R. Richter; Philipp Weigell; H. G. Moser; Anna Macchiolo;
Open Access English
  • Published: 13 Jan 2014
Abstract
Comment: Proceedings for iWoRiD 2013 conference, submitted to JINST
Subjects
arXiv: Physics::Instrumentation and Detectors
free text keywords: Physics - Instrumentation and Detectors, High Energy Physics - Experiment, Instrumentation, Mathematical Physics, Detectors and Experimental Techniques, DESY, Atlas (anatomy), medicine.anatomical_structure, medicine, Optoelectronics, business.industry, business, Physics, Silicon, chemistry.chemical_element, chemistry, Radiation hardening, Beam (structure), Detector, Pixel, Planar
Funded by
EC| AIDA
Project
AIDA
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA

[1] O. Brüning, L. Rossi et al., High Luminosity Large Hadron Collider: A description for the European Strategy Preparatory Group, Tech. Rep. CERN-ATS-2012-236 (2012).

[2] ATLAS Collaboration, Letter of Intent for the Phase-II Upgrade of the ATLAS Experiment, LHCC-I-023 (2012).

[3] C. Gallrapp et al., Performance of novel silicon n-in-p planar Pixel Sensors, Nucl. Instrum. Meth. A679 (2012) 29.

[4] R. Nagai et al., Evaluation of novel KEK/HPK n-in-p pixel sensors for ATLAS upgrade with testbeam, Nucl. Instrum. Meth. A669 (2013) 78.

[5] A. Macchiolo et al., Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC, Nucl. Instrum. Meth. A731 (2013) 210. [OpenAIRE]

[6] A. Macchiolo et al., Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies, In proceedings of 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, September, 1-5, 2013 Hiroshima, Japan, to be published in Nucl. Instrum. Meth. [arxiv.org/abs/arXiv:1310.4984]

[7] L. Andricek et al., Processing of ultra-thin silicon sensors for future e+e linear collider experiments, IEEE Trans. Nucl. Sci. A679 (2012) 29.

[8] M. Garcia-Sciveres et al., The FE-I4 pixel readout integrated circuit, Nucl. Instrum. and Meth. A363 (2012) 29.

[9] I. Peric et al., The FEI3 readout chip for the ATLAS pixel detector, Nucl. Instrum. Meth. A565 (2006) 178.

[10] I. Rubinskiy, An EUDET/AIDA Pixel Beam Telescope for Detector Development, Phys. Proc. 37 (2012) 923.

[11] J. Weingarten et al., Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results, JINST 7 (2012) P10028.

[12] S. Eränen et al., 3D processing on 6 in. resistive SOI wafers: Fabrication of edgeless strip and pixel detectors, Nucl. Instrum. and Meth. A607 (2012) 85.

[13] X. Wu et al., Recent advances in processing and characterization of edgeless detectors, JINST 7 (2012) C02001.

[14] P. Weigell, Investigation of Properties of Novel Silicon Pixel Assemblies Employing Thin n-in-p Sensors and 3D-Integration, PhD Thesis, TU München (2013) [https://publications.mppmu.mpg.de/2013/MPP-2013-5/FullText.pdf]. [OpenAIRE]

[15] USB based readout system for ATLAS FE-I3 and FE-I4 [icwiki.physik.uni-bonn.de/twiki/bin/view/Systems/UsbPix].

Any information missing or wrong?Report an Issue