Subject: CVD | FILMS | P-n heterojunctions | POLYCRYSTALLINE DIAMOND | Boron-doped diamond | SILICON-CARBIDE | RAMAN-SPECTROSCOPY | TRANSPORT | SiC
Diamond and SiC are wide bandgap (WBG)
materials which can be used to fabricate high power devices with
improved performance. The combination of these materials into
one single device is expected to bring some benefits, like a better
thermal management with ... View more
 N. Kaminski, "State of the art and the future of wide band-gap devices," in Power Electronics and Applications, 2009. EPE '09. 13th European Conference on, 2009, pp. 1-9.
 M. Willander, M. Friesel, Q.-u. Wahab, and B. Straumal, "Silicon carbide and diamond for high temperature device applications," Journal of Materials Science: Materials in Electronics, vol. 17, pp. 1-25, 2006/01/01 2006.
 R. Ghandi, C.-P. Chen, L. Yin, R. Saia, T. Johnson, P. Sandvik, K. Fang, and R. W. Johnson, "Reliability of SiC Digital Telemetry Circuits on AlN Substrate," Journal of Microelectronics and Electronic Packaging vol. 11, p. 25, 2014.
 J. C. Z. F. Ren, Wide Band Gap Electronic Devices World Scientific, Singapore, 2003.
 S. R. M. Shur, M. Levinshtein, SiC Materials and Devices World Scientific, Singapore, 2006.
 K. Sheng, Y. Zhang, M. Su, J. H. Zhao, X. Li, P. Alexandrov, and L. Fursin, "Demonstration of the first SiC power integrated circuit," SolidState Electronics, vol. 52, pp. 1636-1646, 2008.
 J. C. B. T. Funaki, J. Junghans, A. S. Kashyap, H. A. Mantooth, F. and T. K. a. T. H. Barlow, "Power conversion with SiC devices at extremely high ambient temperatures " IEEE Trans. Power Electron Device Letters, vol. 22, pp. 1321-1329, 2007.
 A. V. R. A. M. Abou-Alfotouh, H. Chang, and C. Winterhalter, "A 1- MHz hard-switched silicon carbide DC-DC converter," IEEE Trans. Power. Electron., vol. 21, pp. 880-889, 2006.
 J. J. Gracio, Q. H. Fan, and J. C. Madaleno, "Diamond growth by chemical vapour deposition," Journal of Physics D: Applied Physics, vol. 43, p. 374017, 2010.
 C. J. H. Wort and R. S. Balmer, "Diamond as an electronic material," Materials Today, vol. 11, pp. 22-28, 2008.