THERMAL IMAGING OF Si, GaAs AND GaN -BASED DEVICES WITHIN THE MICROTHERM PROJECT

Conference object English OPEN
Pavageau , S.; Tessier , G.; Filloy , C.; Jerosolimski , G.; Fournier , D.; Polignano , M.-L.; Mica , I.; Cassette , S.; Aubry , R.; Durand , O.;
(2005)
  • Publisher: TIMA Editions
  • Subject: thermoreflectance | [INFO.INFO-AR]Computer Science [cs]/Hardware Architecture [cs.AR] | Thermal mapping | [ INFO.INFO-AR ] Computer Science [cs]/Hardware Architecture [cs.AR] | thermal imaging

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Within the european project Microtherm, we have developed a CCD-based thermoreflectance system which delivers thermal images of working integrated circu... View more
  • References (6)

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    [5] P. S. Dobson, G. Mills and J. M. R. Weaver, "Microfabricated temperature standard based on Johnson noise measurement for the calibration of micro- and nano-thermometers", Review of Scientific Instruments, 76, -, 2005

    [6] C. Filloy, G. Tessier, S. Hole, G. Jerosolimski and D. Fournier, "The contribution of thermoreflectance to high resolution thermal mapping", Sensor Review, 23, 35, 2003

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