Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

Conference object, Article, Other literature type, Preprint English OPEN
Calderini, G.;
(2013)
  • Publisher: IOP
  • Related identifiers: doi: 10.1016/j.nima.2014.05.037, doi: 10.1088/1748-0221/10/01/C01027
  • Subject: Detectors and Experimental Techniques | Advanced infrastructures for detector R&D [9] | Physics - Instrumentation and Detectors | physics.ins-det | High Energy Physics - Experiment | Precision Pixel Detectors [9.3] | [ PHYS.HEXP ] Physics [physics]/High Energy Physics - Experiment [hep-ex] | Radiation-hard detectors | Large detector systems for particle and astroparticle physics | [ PHYS.PHYS.PHYS-INS-DET ] Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det] | Particle tracking detectors

In the framework of the HL-LHC upgrade, the ATLAS experiment plans to introduce an all-silicon inner tracker to cope with the elevated occupancy. To investigate the suitability of pixel sensors using the proven planar technology for the upgraded tracker, the ATLAS Plana... View more
  • References (12)
    12 references, page 1 of 2

    193 231 [1] G. Calderini et al., Nucl.Instrum.Meth. A636 (2011) S37-S41. 232 [2] G. Casse et al., DA AGGIUNGERE 233 [3] VTT Technical Research Centre of Finland, P.O. Box 1000, FI-02044 234 VTT, Finland; http://www.vtt.fi 235 [4] A. Macchiolo et al., ”Thin n-in-p pixel sensors and the SLID-ICV verti236 cal integration technology for the ATLAS upgrade at the HL-LHC”, Pro237 ceedings for Pixel 2012 Conference, Nucl. Instr. and Meth. A, in press, 238 http://arxiv.org/abs/1210.7933

    Figure 13: Detail of the metal biasing scheme for a sensor with 50x250 m239 [5] Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-

    pixels designed by the ATLAS Dortmund group and produced by CiS. Di erent240 CMM) Povo di Trento (TN), Italy. http://www.fbk.eu

    geometry designs have been tested to optimise the sensor performance. 241 [6] M. Bomben et al., Nucl. Instrum. and Meth. A 712, 41 (2013). 242 [7] G. Calderini et al., Development of edgeless Silicon pixel sensors on p243 type substrate for the ATLAS High-Luminosity upgrade, Proceedings for

    6. Bulk materials 244 9th HSTD Hiroshima 2013 Conference, Nucl. Instrum. and Meth. A, in 245 press, http://arxiv.org/abs/xxxx.xxxx Special mention needs to be done for a recent study by the246 [8] M. Garcia-Sciveres, D. Arutinov, M. Barbero, et al. The FE-I4 pixel read-

    ATLAS Dortmund group, which is trying to improve the radia-247 out integrated circuit - 2011. Nucl.Instrum.Meth., A636, 155

    tion hardness of n-in-n sensors by the use of a MCz bulk. The248 [9] Santa Cruz Institute for Particle Physics (SCIPP), University of California 249 Santa Cruz, USA.

    intermediate layers of the upgraded ATLAS tracker will be ex-250 [10] U.S. Naval Research Laboratory, 4555 Overlook Ave., SW Washington,

    posed to a mix of ionising and non-ionising radiation. MCz ma-251

    terial is expected to have a better performance with respect to252

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