EFFECT OF SURFACE FINISH OF SUBSTRATE ON MECHANICAL RELIABILITY OF IN-48SN SOLDER JOINTS IN MOEMS PACKAGE
Conference object, Preprint
Koo , Ja-Myeong
Jung , Seung-Boo
- Publisher: TIMA Editions
Eutectic indium-tin (In-48Sn) Solder | metallization | mechanical reliability | intermetallic compound (IMC) | [ INFO.INFO-AR ] Computer Science [cs]/Hardware Architecture [cs.AR] | ball shear test | surface finish | Computer Science - Other Computer Science
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four differ...