publication . Preprint . Other literature type . Article . 2012

Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

Anna Macchiolo; Stefano Terzo; R. Nisius; M. A. Ellenburg; Ladislav Andricek; H. G. Moser; Philipp Weigell; R. Richter;
Open Access English
  • Published: 30 Oct 2012
Abstract
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 um or 150 um, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 um thick sensors with active edge...
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doi: 10.1016/j.nima.2013.04.077
Subjects
free text keywords: Physics - Instrumentation and Detectors, Detectors and Experimental Techniques, Nuclear and High Energy Physics, Instrumentation, Beam (structure), Semiconductor, business.industry, business, Physics, Wire bonding, Large Hadron Collider, Chip, Optoelectronics, Cantilever, Pixel, Interconnection
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Funded by
EC| AIDA
Project
AIDA
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA
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[1] C. Gallrapp et al., “Performance of novel silicon n-in-p planar pixel sensors”, NIM A, Vol. 679 (2012) 29.

[2] A. La Rosa et al., “Novel Silicon n-in-p pixel Sensors for the future ATLAS Upgrades”, NIM A, (2012) in press, arXiv:1205.5305

[3] P. Weigell ”Recent Results of the ATLAS Upgrade Planar Pixel Sensors R&D Project”, these proceedings.

[4] L. Andricek et al., IEEE Trans. Nucl. Sci., Vol. 51, No. 3. (2004), 1117.

[5] A. Macchiolo et al., SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades, Physics Procedia, Volume 37, 2012, Pages 1009- 1015 [OpenAIRE]

[6] L. Andricek et al, Development of thin sensors and of a new interconnection technology for the upgrade of the ATLAS pixel system, Nucl. Instrum. Meth. A 636 (2011) 68.

[7] A. Macchiolo et al, Performance of thin pixel sensors irradiated up to a fluence of 1016 neq cm 2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system, Nucl. Instrum. Meth. A 650 (2011) 145.

[8] P. Weigell et al., “Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2 1015 neq=cm2”, JINST, Vol. 6 (2011), C12049

[9] J. Große-Knetter et al., USBpix - USB based readout system for ATLAS FE-I3 and FE-I4, 3309 http://icwiki.physik.unibonn.de/twiki/bin/view/Systems/UsbPix.

[10] H. Bichsel, Straggling in thin silicon detectors, Rev. Mod. Phys. 60 (1988) 663. [OpenAIRE]

[11] M. Garcia-Sciveres et al., The FE-I4 pixel readout integrated circuit, 353 NIM A, Vol. 636, No. 1 Supplement (2011), S155

[12] The ATLAS IBL Collaboration ”Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip”, http://arxiv.org/abs/1209.1906

[13] J. Weingarten et al.,”Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results”, accepted by JINST, http://arxiv.org/abs/arXiv:1204.1266

[14] J. Kalliopuska et al.,”Results of a Multi Project Wafer Process of Edgeless Silicon Pixel Detectors”, these proceedings.

[15] S. Era¨nen et al., Nucl. Instrum. Meth. A 607 (2009) 85-88.

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