publication . Preprint . Other literature type . Article . 2012

Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

Anna Macchiolo; Stefano Terzo; R. Nisius; M. A. Ellenburg; Ladislav Andricek; H. G. Moser; Philipp Weigell; R. Richter;
Open Access English
  • Published: 30 Oct 2012
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 um or 150 um, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 um thick sensors with active edge...
free text keywords: Physics - Instrumentation and Detectors, Detectors and Experimental Techniques, Nuclear and High Energy Physics, Instrumentation, Beam (structure), Semiconductor, business.industry, business, Physics, Wire bonding, Large Hadron Collider, Chip, Optoelectronics, Cantilever, Pixel, Interconnection
Related Organizations

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