publication . Preprint . Article . 2013

Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

Stefano Terzo; Ladislav Andricek; Anna Macchiolo; Philipp Weigell; R. Richter; R. Nisius; H. G. Moser;
Open Access English
  • Published: 18 Oct 2013
Abstract
Comment: 6 pages, 13 figures, submitted to Nuclear Instruments and Method A as proceedings of the 9th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors
Subjects
free text keywords: Physics - Instrumentation and Detectors, Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Nuclear and High Energy Physics, Instrumentation, Wire bonding, Cantilever, Chip, Optoelectronics, business.industry, business, Pixel, Soldering, Large Hadron Collider, Upgrade, DESY, Physics
Related Organizations

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[3] S. Terzo et al., ”Heavily irradiated n-in-p thin planar pixel sensors with and without active edges”, Proceedings of the iWoRID 2013 Conference, to be published in JINST.

[4] A. Macchiolo et al., ”Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC”, Proceedings for Pixel 2012 Conference, Nucl. Instr. and Meth. A, in press, http://arxiv.org/abs/1210.7933

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[9] X Wu et al., ”Recent advances in processing and characterization of edgeless detectors”, JINST 7 (2012), http://dx.doi.org/10.1088/1748- 0221/7/02/C02001.

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[11] P.Weigell, ”Investigation of Properties of Novel Silicon Pixel Assemblies Employing Thin n-in-p Sensors and 3D-Integration”, PhD Thesis, (2013), TU Munchen CERN-THESIS-2012-229. [OpenAIRE]

[12] http://icwiki.physik.uni-bonn.de/twiki/bin/view/Systems/UsbPix#Hardware

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[15] A. Klumpp et al., ”3D-Integration of Silicon Devices: A Key Technology for Sophisticated Products” in ”Design, Automation Test in Europe Conference Exhibition”, pp. 1678-1683, 2010. [OpenAIRE]

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