publication . Article . 2013

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong;
Restricted English
  • Published: 01 Jan 2013 Journal: IEEE SENSORS JOURNAL (issn: 1530-437X, Copyright policy)
  • Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Abstract
The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity sensor made by functionalized multiwalled carbon nanotubes is fabricated on the same substrate. We evaluate the electrical performance of paper electronics and the reliability...
Subjects
free text keywords: Teknik och teknologier, Heterogeneous system, inkjet printing, Engineering and Technology, paper electronics, f-MWCNTs-based humidity sensor, smart packages
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publication . Article . 2013

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong;