publication . Article . Conference object . 2013

Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade

Theresa Obermann; D. Arutinov; F. Bompard; S Rozanov; P. Breugnon; Tomasz Hemperek; S. Godiot; Hans Krüger; Marlon Barbero; Norbert Wermes; ...
Open Access English
  • Published: 23 Sep 2013
  • Publisher: JINST
  • Country: France
International audience; To face new challenges brought by the upgrades of the LargeHadron Collider at CERN and of the ATLAS pixels detector, for whichhigh spatial resolution, very good signal to noise ratio and highradiation hardness is needed, 3D integrated technologies areinvestigated. In the years to come, the Large Hadron Collider willbe upgraded to Higher Luminosity (HL-LHC). The ATLAS pixel detectorneeds to handle this new challenging environment. As a consequence,3D integrated technologies are pursued with the target of offeringhigher spatial resolution, very good signal to noise ratio andunprecedented radiation hardness. We present here the test resultso...
free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Instrumentation, Mathematical Physics, Front-end electronics for detector readout, Electronic detector readout concepts (solid-state), VLSI circuits, Analogue electronic circuits, 29.40.Gx Tracking and position-sensitive detectors ; 29.50.+v Computer interfaces, [ PHYS.NUCL ] Physics [physics]/Nuclear Theory [nucl-th], [ PHYS.HEXP ] Physics [physics]/High Energy Physics - Experiment [hep-ex], [PHYS.NUCL]Physics [physics]/Nuclear Theory [nucl-th], [PHYS.HEXP]Physics [physics]/High Energy Physics - Experiment [hep-ex], Upgrade, Large Hadron Collider, Radiation hardening, Chip, Computer hardware, business.industry, business, Computer science, Signal-to-noise ratio, Through-silicon via, Electrical engineering, Detector, Three-dimensional integrated circuit
Funded by
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA
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