publication . Article . 2011

An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

Eslami, P.; Taheri, A. Karimi;
Open Access English
  • Published: 01 Jun 2011 Journal: Materials Letters, volume 65, issue 12, pages 1,862-1,864 (issn: 0167-577X, eissn: 1873-4979, Copyright policy)
  • Publisher: Elsevier BV
Abstract
A new method for production of bimetallic rods, utilizing the equal channel angular extrusion (ECAE) process has been introduced before by previous researchers, but no attempt has been made to assess the effect of different temperatures and holding times in order to achieve a diffusional bond between the mating surfaces. In present research copper sheathed aluminum rods have been ECAEed at room temperature and subsequently held at a constant ECAE pressure, at different temperatures and holding times to produce a diffusional bond between the copper sheath and the aluminum core. The bonding quality of the joints was examined by shear strength test and a sound bond...
Subjects
free text keywords: Materials Science(all), Diffusion bonding, Shear strength, Mechanical Engineering, Bonding temperature, Condensed Matter Physics, Holding time, Mechanics of Materials, Equal channel angular extrusion, Article
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publication . Article . 2011

An investigation on diffusion bonding of aluminum to copper using equal channel angular extrusion process

Eslami, P.; Taheri, A. Karimi;