Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing

Article English OPEN
Li, J ; Monaghan, T ; Nguyen, TT ; Kay, RW ; Friel, RJ ; Harris, RA (2017)

This work proposes a new method for the fabrication of Multifunctional Metal Matrix Composite (MMC) structures featuring embedded printed electrical materials through Ultrasonic Additive Manufacturing (UAM). Printed electrical circuitries combining conductive and insulating materials were directly embedded within the interlaminar region of UAM aluminium matrices to realise previously unachievable multifunctional composites. A specific surface flattening process was developed to eliminate the risk of short circuiting between the metal matrices and printed conductors, and simultaneously reduce the total thickness of the printed circuitry. This acted to improve the integrity of the UAM MMC’s and their resultant mechanical strength. The functionality of embedded printed circuitries was examined via four-point probe measurement. DualBeam Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) milling were used to investigate the microstructures of conductive materials to characterize the effect of UAM embedding energy whilst peel testing was used to quantify mechanical strength of MMC structures in combination with optical microscopy. Through this process, fully functioning MMC structures featuring embedded insulating and conductive materials were realised whilst still maintaining high peel resistances of ca. 70 N and linear weld densities of ca. 90%.
  • References (14)
    14 references, page 1 of 2

    [1] Weiss LE, Prinz FB, Neplotnik G, Padmanabhan P, Schultz L, Merz R. Shape deposition manufacturing of wearable computers. Proc. 1996 Solid Free. Fabr. Symp., 1996, p. 10- 2.

    [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] [17] [18] Weiss LE, Merz R, Prinz FB, Neplotnik G, Padmanabhan P, Schultz L, et al. Shape deposition manufacturing of heterogeneous structures. J Manuf Syst 1997;16:239-48.

    doi:10.1016/S0278-6125(97)89095-4.

    Medina F, Lopes A, Inamdar A, Hennessey R, Palmer J, Chavez B, et al. Hybrid Manufacturing: Integrating Direct-Write and Stereolithography. Proc. 2005 Solid Free.

    Fabr. Symp., 2005, p. 39-49.

    Lopes A, Navarrete M, Medina F, Palmer J, MacDonald E, Wicker R. Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form. Proc. 2006 Solid FPree.

    Fabr. Symp., 2006, p. 644-55.

    Dapino M. Additive Manufacturing of Smart Metallic Structures 2012:2-4.

    doi:10.1117/2.1201401.005322.

    Sojiphan K, Sriraman MR, Babu SS. Stability of microstructure in Al3003 builds made by very high power ultrasonic additive manufacturing. Proc. 2010 Solid Free. Symp., 2010, p. 362-71.

  • Metrics
    No metrics available
Share - Bookmark