publication . Article . Other literature type . 2016

Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages

Lee, Chean Shen; Zhang, Guang-Ming; Harvey, David M.; Qi, Ailing;
Open Access
  • Published: 01 Apr 2016 Journal: NDT & E International, volume 79, pages 1-6 (issn: 0963-8695, Copyright policy)
  • Publisher: Elsevier BV
  • Country: United Kingdom
Abstract
The miniaturization and three dimensional die stacking in advanced microelectronic packages poses a big challenge to their non-destructive evaluation by acoustic micro imaging. In particular, their complicated structures and multiple interfaces make the interpretation of acoustic data even more difficult. A common phenomenon observed in acoustic micro imaging of microelectronic packages is the edge effect phenomena, which obscures the detection of defects such as cracks and voids. In this paper, two dimensional finite element modelling is firstly carried out to numerically simulate acoustic micro imaging of modern microelectronic packages. A flip-chip with a 140...
Subjects
free text keywords: Microelectronics, business.industry, business, Void (astronomy), Temperature cycling, Soldering, Finite element method, Materials science, Electronic engineering, Transducer, Fracture mechanics, Miniaturization, TK
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