Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

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Strusevich, Nadezhda; Desmulliez, Marc P.Y.; Abraham, Eitan; Flynn, David; Jones, Thomas; Patel, Mayur; Bailey, Christopher;

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that ac... View more
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