Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

Article English OPEN
Strusevich, Nadezhda ; Desmulliez, Marc P.Y. ; Abraham, Eitan ; Flynn, David ; Jones, Thomas ; Patel, Mayur ; Bailey, Christopher (2013)

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.
  • References (14)
    14 references, page 1 of 2

    [1] Strusevich N, Bailey C, Costello S, Patel M, Desmulliez MPY (2013) Numerical modeling of electroplating process for microvia fabrication. In: EuroSimE conference, Wroclaw, Poland, April 2013.

    [2] Andricacos PC, Uzoh C, Dukovic JO, Horcans J, Deligianni H (1998) Damascene copper electroplating for chip interconnects. IBM J Res Dev 42(5):567−574

    [3] Moffat TP,. Wheeler D, Kim S-K Josell D (2006) Curvature enhanced adsorbate coverage model for electrodeposition. JES 153(2):C127−C132

    [4] Frampton KD, Martin SE, Minor K (2003) The scaling of acoustic streaming for application in micro-fluidic devices. Appl Ac 64:681−692

    [5] Kirby BJ (2010) Micro- and nanoscale fluid mechanics: Transport in microfluidic devices. Cambridge University Press, Cambridge

    [6] Low CTJ, Roberts EPL, Walsh FC (2007) Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder hull cell. Electrochem Acta 52:3831−3840

    [7] Wheeler D, Josell D, Moffat TP (2003) Modeling superconformal electrodeposition using the level set method. JES 150(5):C302−C310

    [8] PHYSICA, Multiphysics Software Ltd, London, 2000, http://www.multi-physics.com

    [9] Fang C (2011) Croissance electrolytique du cuivre appliquii a la technologie system in package. PhD thesis. University of Rennes, France

    [10] Lord Rayleigh (1945) The Theory of Sound. Dover, New York

  • Similar Research Results (1)
  • Metrics
    0
    views in OpenAIRE
    0
    views in local repository
    25
    downloads in local repository

    The information is available from the following content providers:

    From Number Of Views Number Of Downloads
    Greenwich Academic Literature Archive - IRUS-UK 0 25
Share - Bookmark