Real-time temperature estimation in a multiple device power electronics system subject to dynamic cooling

Article English OPEN
Davidson, J.N.; Stone, D.A.; Foster, M.P.; Gladwin, D.T.;
(2016)
  • Publisher: IEEE

This paper presents a technique to estimate the temperature of each power electronic device in a thermally coupled, multiple device system subject to dynamic cooling. Using a demonstrator system, the thermal transfer impedance between pairs of devices is determined in t... View more
  • References (26)
    26 references, page 1 of 3

    [1] M. Gerber, J. A. Ferreira, N. Seliger, and I. W. Hofsajer, “Integral 3- D thermal, electrical and mechanical design of an automotive DC/DC converter,” IEEE Trans. Power Electron., vol. 20, no. 3, pp. 566-575, May 2005.

    [2] V. Smet, F. Forest, J.-J. Huselstein, F. Richardeau, Z. Khatir, S. Lefebvre, and M. Berkani, “Ageing and failure modes of IGBT modules in hightemperature power cycling,” IEEE Trans. Ind. Electron., vol. 58, no. 10, pp. 4931-4941, Oct. 2011.

    [3] H. Lu, C. Bailey, and C. Yin, “Design for reliability of power electronics modules,” Microelectron. Rel., vol. 49, no. 9-11, pp. 1250-1255, Sep.- Nov. 2009.

    [4] P. Ning, G. Lei, F. Wang, and K. D. T. Ngo, “Selection of heatsink and fan for high-temperature power modules under weight constraint,” in Proc. 23rd Annu. IEEE Conf. Appl. Power Electron. Conf. Expo., Feb. 2008, pp. 192-198.

    [5] L. Meysenc, M. Jylhakallio, and P. Barbosa, “Power electronics cooling effectiveness versus thermal inertia,” IEEE Trans. Power Electron., vol. 20, no. 3, pp. 687,693, May 2005.

    [6] L. Fried, “Prediction of temperatures in forced-convection cooled electronic equipment,” IRE Trans. Compon. Parts, vol. CR-5, no. 2, pp. 102-107, Jun. 1958.

    [7] C. Lundquist and V. P. Carey, “Microprocessor-based adaptive thermal control for an air-cooled computer CPU module,” in Proc. 17th Annu. IEEE Symp. Semicond. Therm. Meas. Manag., 2001, pp. 168-173.

    [8] M. Musallam and C. M. Johnson, “Real-time compact thermal models for health management of power electronics,” IEEE Trans. Power Electron., vol. 25, no. 6, pp. 1416-1425, Jun. 2010.

    [9] G. C. James, V. Pickert, and M. Cade, “A thermal model for a multichip device with changing cooling conditions,” in Proc. 4th IET Conf. Power Electron., Mach. Drives, 2008, pp. 310-314.

    [10] G. Xiong, M. Lu, C.-L. Chen, B. P. Wang, and D. Kehl, “Numerical optimization of a power electronics cooling assembly,” in Proc. IEEE 16th Annu. Appl. Power Electron. Conf. Expo., 2001, vol. 2, pp. 1068-1073.

  • Metrics
Share - Bookmark