Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

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Yang, Li ; Agyakwa, Pearl A. ; Johnson, C. Mark (2013)

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire\ud bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological\ud considerations based on some unusual observations\ud highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.
  • References (46)
    46 references, page 1 of 5

    [1] M. Pecht, B. Tuchband, N. Vichare, and Q. J. Ying, “Prognostics and health monitoring of electronic,” in Proc. Int. Conf. EuroSime, 2007, pp. 1-8.

    [2] M. Pecht, A. Dasgupta, and P. Lall, “A failure prediction model for wire bonds,” in Proc. ISHM, Baltimore, MD, Oct. 17-19, 1989, pp. 607-613.

    [3] C. A. Preussger, R. Blish, S. Huber, T. Dellin, and N. Lycoudes, “Understanding and developing knowledge-based qualifications of silicon devices,” Int. SEMATECH, Austin, TX, Technol. Transf. 04024492A-TR, Mar. 30, 2004.

    [4] K. Upadhyayula and A. Dasgupta, “Physics-of-failure guidelines for accelerated qualification of electronic systems,” Qual. Reliab. Eng. Int., vol. 14, no. 6, pp. 433-447, Nov./Dec. 1998.

    [5] M. J. Cushing, D. E. Mortin, T. J. Stadterman, and A. Malhotra, “Comparison of electronics-reliability assessment approaches,” IEEE Trans. Rel., vol. 42, no. 4, pp. 542-546, Dec. 1993.

    [6] M. Pecht and A. Dasgupta, “Physics-of-failure: An approach to reliable product development,” J. Inst. Environ. Sci., vol. 38, no. 5, pp. 30-34, Sep./Oct. 1995.

    [7] L. F. Coffin, Jr., “A study of the effects of cyclic thermal stresses on a ductile metal,” Trans. ASME, vol. 76, no. 6, pp. 931-950, 1954.

    [8] S. S. Manson, “Behaviour of materials under conditions of thermal stress,” NACA, Washington, DC, Rep. No. 1170, 1954.

    [9] H. L. L. Pang, T. L. Tan, J. F. Leonard, and Y. S. Chen, “Reliability assessment of a wirebond chip-on-board package subjected to accelerated thermal cycling loading,” in Proc. IEEE/CPMT, 1997, pp. 93-97.

    [10] N. V. Chidambaram, “A numerical and experimental study of temperature cycle wire bond failure,” in Proc. 41st ECTE, 1991, pp. 877-882.

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