publication . Article . 2014

Failure of Silicon Substrates Embedded in Epoxy Resin

Dumstorff, Gerrit; Lang, Walter;
Open Access
  • Published: 01 Jan 2014 Journal: Procedia Technology, volume 15, pages 216-220 (issn: 2212-0173, Copyright policy)
  • Publisher: Elsevier BV
Abstract
Abstract For cyber physical systems and structural health monitoring sensors have to be embedded in a material. Therefore two types of inlays (sensors) can be used: conventional inlays made of silicon as substrate material or new developed inlays made of non-conventional substrates. In this paper we will focus on embedding conventional inlays made of mono crystal silicon. Inlays had been embedded in test specimens for pull and bending tests to measure the ultimate tensile and bending strength. In the pulling tests the ultimate tensile strength decreases dramatically in comparison to pulling tests where no inlay is embedded. For the bending tests the results were...
Subjects
free text keywords: Structural health monitoring, Ultimate tensile strength, Inlay, Flexural strength, Silicon, chemistry.chemical_element, chemistry, Composite material, Epoxy, visual_art.visual_art_medium, visual_art, Bending, Fiber, Materials science, Sensor embedding, silicon in epoxy
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