Oriented Columnar Structure of a Thin Intermetallic Film Cu6Sn5

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Макрушина, А.Н.; Плотников, В.А.; Демьянов, Б.Ф.;
(2017)

Проведенные исследования интерметаллической пленки Cu6Sn5 обнаружили новый тип структуры - нанокристаллическую высокоориентированную столбчатую структуру. Исследованы процессы синтеза интерметаллических соединений в многослойных тонких пленках системы Cu-Sn, локализован... View more
  • References (14)
    14 references, page 1 of 2

    1. McCormack M., Jin Improved S. Mechanical Properties in New, Pb-Free Solder Alloys // Journal of Electronic Materials. - 1994. - Vol. 23, No.8.

    2. Xiao W., Shi Y., Lei Y., Xia Z., Guo F. Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys // Journal of Electronic Materials. - 2006. - Vol. 35, No.5.

    3. Bertheau J., Hodaj F., Hotellier N., Charbonnier J. Effect of intermetallic compound thickness on shear strength of 25 mkm diameter Cu-pillars // Intermetallics. - 2014. - Vol. 51.

    4. Yoon J.-W., Kim S.-W., Koo J.-M. Reliability Investigation and Interfacial Reaction of Ball-Grid-Array Packages Using the Lead-Free Sn-Cu Solder // Journal of Electronic Materials. - 2004. - Vol. 33, No.10.

    5. Zeng G., Xue S., Zhang L., Gao L., Dai W., Luo J. A review on the interfacial intermetallic compounds between SnAg-Cu based solders and substrates // J Mater Sci: Mater Electron. - 2010. - Vol. 21.

    6. Choi W.J., Lee T.Y., Tu K.N., Tamura N., Celestre R.S., MacDowell A.A., Bong Y.Y., Nguyen L. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction // Acta Materialia. - 2003. - Vol. 51.

    7. Xu G.-S., Zeng J.-B., Zhou M.-B., Cao S.-S., Ma X., Zhang X.-P. Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of Cu6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Interface // International Conference on Electronic Packaging Technology and High Density Packaging. - 2012.

    8. Choudhury S.F., Ladani L. Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis // Journal of Electronic Materials. - 2014.

    9. Tu K.N. Interdiffusion and reaction in bimetallic Cu-Sn thin films // Acta Metall. - 1973. - Vol. 21, No.4.

    10. Song J.-M., Huang B.-R., Liu C.-Y., Lai Y.-S., Chiu Y.-T., Huang T.-W. Nanomechanical responses of intermetallic phase at the solder joint interface - Crystal orientation and metallurgical effects // Materials Science and Engineering A. - 2012. - Vol. 534.

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