organization

IHP GMBH

IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
  • Country: Germany
60 projects, page 1 of 12
  • project . 2021 - 2022
    Funder: EC Project Code: 963923
    Funder Contribution: 150,000 EUR
    Open Access mandate for Publications
    Partners: MPG, IHP GMBH

    Voltage droops are unpredicted drops in the supply voltage of computer chips, which often occur as a result of nearby bursts of high intensity circuit activity. This proposal is concerned with fast voltage droops, where voltage drops within a few clock cycles. This mean...

  • project . 2019 - 2023
    Funder: EC Project Code: 857558
    Overall Budget: 791,812 EURFunder Contribution: 791,812 EUR
    Open Access mandate for Publications and Research Data
    Partners: IHP GMBH, UGR, UCC, University of Niš, Faculty of Electronic Engineering

    ELICSIR project is aimed at significant strengthening of the research and innovation capacity of the Faculty of Electronic Engineering, University of Nis, Serbia (EF-UNINIS), in the field of electronic instrumentation for radiation environments, namely radiation dosimet...

  • project . 2015 - 2016
    Funder: EC Project Code: 640073
    Overall Budget: 1,039,360 EURFunder Contribution: 1,039,360 EUR
    Open Access mandate for Publications
    Partners: RCD, IHP GMBH, University of Jyväskylä, IUNET

    The project aims to realize a strong methodology for the development and design of a radiation hard non-volatile memory technology by using standard CMOS silicon processing. Since standard silicon memories, such as flash memories tend to fail under irradiation, a new ap...

  • project . 2018 - 2021
    Funder: EC Project Code: 776350
    Overall Budget: 2,568,110 EURFunder Contribution: 2,568,110 EUR
    Open Access mandate for Publications
    Partners: IHP GMBH, University of L'Aquila, MEC, SAPHYRION, THALES ALENIA SPACE ITALIA SPA

    The ATOS project will develop and qualify a new generation of X band T/R modules, based on GaN HEMT and SiGe BiCMOS technology, with innovative packaging techniques that minimize the footprint, and will integrate a set of T/R modules in a demonstrator of a high-efficien...

60 projects, page 1 of 12
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