Comment: 45 pages, 30 figures, submitted to JINST

Comment: 26 pages, 14 figures

On behalf of the CALICE Collaboration; International audience; The CALICE collaboration is preparing large scale prototypes of highly granular calorimeters for detectors to be operated at a future linear electron positron collider. After several beam campaigns at DESY, ...

On behalf of the CALICE Collaboration; International audience; This article reports on first experience with the technological prototype of a highly- granular silicon-tungsten electromagnetic calorimeter as envisaged for the detectors at a future lepton collider. In the...

A new type of n-in-p planar pixel sensors have been developed at KEK/HPK in order to cope with the maximum particle fluence of 1-3×1016 1 MeV equivalent neutrons per square centimeter (neq/cm2) in the upcoming LHC upgrades. Four n-in-p devices were connected by bump-bon...

International audience; The FE-I4 is a new pixel readout integrated circuit designed to meet the requirements of ATLAS experiment upgrades. The first samples of the FE-I4 engineering run (called FE-I4A) delivered promising results in terms of the requested performances....

The high luminosity upgrade of the Large Hadron Collider, foreseen for 2026, necessitates the replacement of the CMS experiment’s silicon tracker. The innermost layer of the new pixel detector will be exposed to severe radiation, corresponding to a 1 MeV neutron equival...

Comment: 11 pages, 9 figures, PSD10: 10th International Conference on Position Sensitive Detectors. Updated from minor revisions requested from referee

This thesis deals with two aspects of the International Linear Collider (ILC) which is a project of a linear electron-positron collider of up to at least 500 GeV center of mass energy.The first aspect is the development of a silicon-tungsten electromagnetic calorimeter ...

International audience; To face new challenges brought by the upgrades of the LargeHadron Collider at CERN and of the ATLAS pixels detector, for whichhigh spatial resolution, very good signal to noise ratio and highradiation hardness is needed, 3D integrated technologie...