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- publication . Article . 2012Open Access EnglishAuthors:Marlon Barbero; M. Rothermund; Norbert Wermes; L. Gonella; Hans Krüger; Fabian Hügging; T. Fritzsch;Publisher: JINSTProject: EC | AIDA (262025)
Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. Demonstrator modules ...
- publication . Article . 2014Open Access EnglishAuthors:Hermann Oppermann; M Woehrmann; T. Fritzsch; Oswin Ehrmann; Kai Zoschke; M. Rothermund; F. Huegging; Klaus Dieter Lang;Project: EC | AIDA (262025)
There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafe...
- publication . Article . Preprint . 2012Open Access EnglishAuthors:Tobias Flick; Yunpeng Lu; Alex Sood; Daniel Dobos; Daniel Dzahini; Edwin Spencer; Michal Sloboda; Patrick Skubic; Oswin Ehrmann; Yoshinobu Unno; ...Publisher: HAL CCSDProject: NSERC , EC | AIDA (262025)
Comment: 45 pages, 30 figures, submitted to JINST
- publication . Article . Preprint . 2011Open AccessAuthors:Attilio Ferrari; G. Porrovecchio; Ennio Morelli; Massimo Trifoglio; D. Zanello; P. Picozza; A. Pellizzoni; Alda Rubini; F. Perotti; Luigi Pacciani; ...Publisher: Elsevier BVProject: EC | AIDA (262025)
Comment: 23 pages; 17 figures. Second and final version accepted by Nucl. Instr. & Meth. A
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