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7 research outcomes, page 1 of 1
  • publication . Article . Conference object . 2013
    Open Access English
    Authors:
    Theresa Obermann; D. Arutinov; F. Bompard; S Rozanov; P. Breugnon; Tomasz Hemperek; S. Godiot; Hans Krüger; Marlon Barbero; Norbert Wermes; ...
    Publisher: JINST
    Project: EC | AIDA (262025)

    International audience; To face new challenges brought by the upgrades of the LargeHadron Collider at CERN and of the ATLAS pixels detector, for whichhigh spatial resolution, very good signal to noise ratio and highradiation hardness is needed, 3D integrated technologie...

  • publication . Other literature type . Conference object . Article . 2012
    Open Access English
    Authors:
    M. A. Kagan;
    Project: EC | AIDA (262025)

    \nPDF\nOverview of the ATLAS Insertable B-Layer (IBL) Project\nSubmitted by Clara Troncon on 30 May 2013 at 23:12\nId: 5\nLast modification: 30 May 2013 23:12\nContribution type: ORAL\nContent\nThe upgrades for the ATLAS Pixel Detector will be staged in preparation for ...

  • publication . Article . 2012
    Open Access English
    Authors:
    Marlon Barbero; M. Rothermund; Norbert Wermes; L. Gonella; Hans Krüger; Fabian Hügging; T. Fritzsch;
    Publisher: JINST
    Project: EC | AIDA (262025)

    Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. Demonstrator modules ...

  • publication . Conference object . Article . 2012
    Open Access English
    Authors:
    Maurice Garcia-Sciveres; F. Gensolen; P. Breugnon; Y. Lu; Malte Backhaus; J.D. Schipper; R. Kluit; L. M. Caminada; D. Arutinov; A. Mekkaoui; ...
    Publisher: HAL CCSD
    Project: EC | AIDA (262025)

    International audience; The FE-I4 chip for the B-layer upgrade is designed in a 130 nm CMOS process. For this design, configuration memories are based on the DICE latches where layout considerations are followed to improve the tolerance to SEU. Tests have shown that DIC...

  • publication . Article . 2014
    Open Access English
    Authors:
    Hermann Oppermann; M Woehrmann; T. Fritzsch; Oswin Ehrmann; Kai Zoschke; M. Rothermund; F. Huegging; Klaus Dieter Lang;
    Project: EC | AIDA (262025)

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafe...

  • publication . Article . Preprint . 2012
    Open Access English
    Authors:
    Tobias Flick; Yunpeng Lu; Alex Sood; Daniel Dobos; Daniel Dzahini; Edwin Spencer; Michal Sloboda; Patrick Skubic; Oswin Ehrmann; Yoshinobu Unno; ...
    Publisher: HAL CCSD
    Project: NSERC , EC | AIDA (262025)

    Comment: 45 pages, 30 figures, submitted to JINST

  • publication . Conference object . Article . 2011
    Open Access English
    Authors:
    R. Kluit; Giovanni Darbo; Malte Backhaus; Mohsine Menouni; Marlon Barbero; L. Gonella; Alexandre Rozanov; J. Fleury; Frank Jensen; J.D. Schipper; ...
    Publisher: HAL CCSD
    Project: EC | AIDA (262025)

    International audience; The FE-I4 is a new pixel readout integrated circuit designed to meet the requirements of ATLAS experiment upgrades. The first samples of the FE-I4 engineering run (called FE-I4A) delivered promising results in terms of the requested performances....

7 research outcomes, page 1 of 1