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2 research outcomes, page 1 of 1
  • publication . Article . 2014
    Flip chip assembly of thinned chips for hybrid pixel detector applications
    Open Access English
    Authors:
    Hermann Oppermann; M Woehrmann; T. Fritzsch; Oswin Ehrmann; Kai Zoschke; M. Rothermund; F. Huegging; Klaus Dieter Lang;
    doi: 10.1088/1748-0221/9/05/c05039
    Project: EC | AIDA (262025)

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafe...

  • publication . Article . Preprint . 2012
    Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
    Open Access English
    Authors:
    Tobias Flick; Yunpeng Lu; Alex Sood; Daniel Dobos; Daniel Dzahini; Edwin Spencer; Michal Sloboda; Patrick Skubic; Oswin Ehrmann; Yoshinobu Unno; ...
    doi: 10.1088/1748-0221/7/11/p11010
    Publisher: HAL CCSD
    Project: NSERC , EC | AIDA (262025)

    Comment: 45 pages, 30 figures, submitted to JINST

2 research outcomes, page 1 of 1