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3 research outcomes, page 1 of 1
  • publication . Article . 2014
    Open Access
    Authors:
    Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.;
    Publisher: IOP Publishing
    Project: EC | AIDA (262025)

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafe...

  • publication . Article . Preprint . 2012
    Open Access English
    Authors:
    Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, L.S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; ...
    Publisher: IOP PUBLISHING LTD
    Project: EC | AIDA (262025), NSERC

    Comment: 45 pages, 30 figures, submitted to JINST

  • publication . Article . 2012
    Open Access English
    Authors:
    Barbero, M; Fritzsch, T; Gonella, L; Hügging, F; Krüger, H; Rothermund, M; Wermes, N;
    Project: EC | AIDA (262025)

    Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. Demonstrator modules ...

3 research outcomes, page 1 of 1
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