Comment: 35 pages, 21 figures, 8 tables

International audience; The FE-I4 chip for the B-layer upgrade is designed in a 130 nm CMOS process. For this design, configuration memories are based on the DICE latches where layout considerations are followed to improve the tolerance to SEU. Tests have shown that DIC...

Lepton colliders are considered as options to complement and to extend the physics programme at the Large Hadron Collider. The Compact Linear Collider (CLIC) is an $e^+e^-$ collider under development aiming at centre-of-mass energies of up to 3 TeV. For experiments at C...

In view of the LHC upgrade for the high luminosity phase (HL-LHC), the ATLAS experiment is planning to replace the inner detector with an all-silicon system. The n-in-p bulk technology represents a valid solution for the modules of most of the layers, given the signific...

CMOS active pixel sensors are being investigated for their potential use in the ATLAS\ud inner tracker upgrade at the HL-LHC. The new inner tracker will have to handle a significant\ud increase in luminosity while maintaining a sufficient signal-to-noise ratio and pulse...

This paper focuses on the performance of analog readout electronics (built-in amplifier) integrated on the high-voltage (HV) CMOS silicon sensor chip, as well as its radiation hardness. Since the total collected charge from minimum ionizing particle (MIP) for the CMOS s...

The response of n+p silicon strip sensors to electrons from a 90Sr source was measured using a multi-channel read-out system with 25 ns sampling time. The measurements were performed over a period of several weeks, during which the operating conditions were varied. The ...

The international Muon Ionization Cooling Experiment (MICE) will perform a systematic investigation of ionization cooling with muon beams of momentum between 140 and 240\,MeV/c at the Rutherford Appleton Laboratory ISIS facility. The measurement of ionization cooling in...

Abstract The optical emission from the 5d – 4f allowed transition of Pr 3+ ions embedded in sol-gel silica is investigated for High Energy Physics applications requiring fast scintillating materials. A complete and detailed characterization of the optical, scintillation...

Abstract 3D silicon sensors, where plasma micromachining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, were successfully manufactured in facilities in Europe and USA. In 2011 the technology underwent a qualification ...